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E2E0037-27-Y3
Semiconductor MSM64169
Semiconductor
This version: MSM64169 Jan. 1998 Previous version: Mar. 1996
in im el Pr y ar
Built-in Dual-slope type A/D Converter and LCD Driver 4-Bit Microcontroller
GENERAL DESCRIPTION
The MSM64169 is a low-power 4-bit microcontroller that incorporates OKI's nX-4/30 CPU core. The MSM64169 has a minimum instruction execution time of 4.3 ms (@ 700 kHz). The device contains 8160 bytes of program memory, a 1024-nibble data memory, a dual-slopetype A/D converter with a 4-channel input, LCD drivers that can drive up to 240 segments, a synchronous/ asynchronous selectable serial port, a 16-bit timer, and a buzzer output port. Applications include high resolution thermometers with low power consumption, barometers, and hygrometers.
FEATURES
* Operating range Operating frequencies (dual clock) Operating voltage Operating temperature * Memory space Internal program memory Internal data memory * Minimum instruction execution time * Dual-slope type A/D converter * LCD drivers (1) At 1/4 duty, 1/3 bias (2) At 1/3 duty, 1/3 bias (3) At 1/2 duty, 1/2 bias * Buzzer driver * Timer Auto-reload mode Capture mode Clock frequency measuring mode * Watchdog timer * Clock CPU clock Time base clock * Power supply voltage * I/O port * Output only port * Serial port Synchronous mode Asynchronous mode * Interrupts
: 32 kHz, 700 kHz : 2.6 V to 3.6 V : -40C to +85C : 8160 bytes : 1024 nibbles : 4.3 ms (@ 700 kHz) 91.6 ms (@ 32.768 kHz) : 1; 4-channel input : 64; duty ratio switchable by software : 240 segments (max.) : 183 segments (max.) : 124 segments (max.) : 1; four modes for controlling buzzer output ON/OFF : 16-bit 1
: 32.768 kHz quartz oscillator and 700 kHz RC oscillator (with an external resistor) : 32.768 kHz/700 kHz (selectable by software) : 32.768 kHz : 3 V low power : 3 ports 4 bits : 2 ports 4 bits (8 out of 64 LCD drivers can be used as output-only ports via mask programming) : Synchronous/asynchronous mode support : 32.768 kHz/external clock : 9600 bps/4800 bps/2400 bps/1200 bps : 10 sources (2 external, 8 internal) 1/25
Semiconductor
MSM64169
* Capture circuit : 2 channels * Package: 128-pin plastic QFP (QFP128-P-1420-0.50-K) : (Product name: MSM64169-xxxGS-K) Chip : (Product name: MSM64169-xxx) xxx indicates the code number. * OTP version (under development) : (Product name: MSM64P169) Note: The MSM64P169 is diffrent from the MSM64169 in the polarity of the power supply voltage and the operating voltage.Refer to the MSM64P169 user's manual for details.
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Semiconductor
BLOCK DIAGRAM
BIAS
BSR
TR2
TR0
(4)
TR1 PCM PCL PCH A11- A8 A7 - A0
ROM 8160B
PORT ADDRESS
VDD VSS1 VSS2 VSS3 C1 C2 L0 L1 L63 VSS
LCD
OSC2 OSC1 XT XT RESET TST1 TST2 VSSL
HALT MIEF
C
ALU
B
A
H
L
X
Y
RAM 1024N INT INT
P0 P1
P0.0 P0.1 P1.3
(4)
(4)
DB7- DB0
(8)
VSS P2 P2.0 P2.1 P2.2 P2.3
2CLK
TIMING CONTROLLER
SP
ROMR
SIOP 2 INT
DECODER
RSTG
TBC 3 INT
(8)
INT
IR
IR
VSS VSSA OPP1 OPN1 OPO1 OPP0 OPN0 OPO0 VOF
TST
PORT ADDRESS DB7- DB0 INT WDT INTC TM INT CAPR BD ADC
VR
MSM64169
3/25
is the CPU core (nX-4/30).
BD
RCM VG CZ2 CI CZ1 RI RA AIN3 AIN2 AIN1 AIN0 VrA VDDA
Semiconductor
MSM64169
PIN CONFIGURATION (TOP VIEW)
VDDA VG CZ2 CI CZ1 RCM RI RA AIN3 AIN2 AIN1 (NC) AIN0 VOF (NC) (NC) (NC) (NC) (NC) VrA VSSL RESET TST2 TST1 BD VSS1 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103
OPO0 OPN0 OPP0 OP01 OPN1 OPP1 VSSA VSS P0.0 P0.1 (NC) P0.2 (NC) P0.3 (NC) P1.0 P1.1 (NC) P1.2 (NC) P1.3 P2.0 (NC) P2.1 P2.2 P2.3 L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 L10 L11
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38
39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64
102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65
VSS3 C1 C2 VSS2 XT XT VDD OSC1 OSC2 L63 L62 L61 L60 L59 L58 L57 L56 (NC) L55 L54 L53 (NC) L52 L51 L50 L49 (NC) L48 L47 L46 L45 L44 L43 L42 L41 L40 L39 L38
L12 L13 L14 L15 L16 L17 L18 L19 L20 L21 L22 L23 L24 L25 L26 L27 L28 L29 L30 L31 L32 L33 L34 L35 L36 L37
NC: No-connection pin 128-Pin Plastic QFP 4/25
Semiconductor
MSM64169
PIN DESCRIPTIONS
Basic Functions
Function Pin 96 103 99 102 8 Power Supply 101 100 108 7 128 98 Oscillation 97 95 94 Test 105 106 Pad Symbol Type 86 93 89 92 7 91 90 98 6 112 88 87 85 84 95 96 VDD VSS1 VSS2 VSS3 VSS C1 C2 VSSL VSSA VDDA XT XT OSC1 OSC2 TST1 TST2 -- -- -- -- -- -- -- -- -- -- I O I O I I System reset input: when this pin is asserted to "H" after being pulled to "L", the microcontroller's internal state is initialized and Reset 107 97 RESET I instruction execution starts from address 000H. This pin is pulled up to VDD internally. Input pins for test: pulled up to VDD internally. Negative power supply pin for internal logic (internally generated constant voltage) Negative power supply for A/D converter: externally connects to VSS2. 0V power supply for A/D converter: externally connects to VDD. Low speed clock oscillation input pin: connects to the crystal oscillator (32.768kHz). High speed clock pins: connects to the oscillation resistor (ROS). 0V power supply Bias output for LCD drive (-1.5V) Negative power supply: bias output for LCD drive (-3.0V) Bias output for LCD drive (-4.5V) Negative power supply for input/output port interface Capacitor connection for LCD-drive bias generation Description
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Semiconductor Basic Functions (Continued)
Function Pin 9 10 12 14 16 17 Ports 19 21 22 24 25 26 Buzzer 104 116 118 119 120 121 122 123 124 125 126 A/D Converter 127 109 115 3 6 2 5 1 4 Pad Symbol Type 8 9 10 11 12 13 14 15 16 17 18 19 94 101 102 103 104 105 106 107 108 109 110 111 99 100 2 5 1 4 113 3 P0.0 P0.1 P0.2 P0.3 P1.0 P1.1 P1.2 P1.3 P2.0 P2.1 P2.2 P2.3 BD AIN0 AIN1 AIN2 AIN3 RA RI RCM CZ1 CI CZ2 VG VrA VOF OPP0 OPP1 OPN0 OPN1 OPO0 OPO1 I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O O I/O I/O I/O I/O -- -- -- -- -- -- -- I I I I I I O O Current-adjusting resistor connection pin Pin for connecting resistor for integration Description
MSM64169
4-bit I/O port (P0): each bit can be configured to be an input/output, pull-up/pull-down resistor input/high impedance input, or NMOS open drain output/CMOS output by port 0 control registers 0-3 (P00CON-P03CON). An external interrupt function is assigned to each pin. 4-bit I/O port (P1): each bit can be configured to be an input/output, pull-up/pull-down resistor input/high impedance input, or NMOS open drain output/CMOS output by port 1 control registers 0-3 (P10CON-P13CON). An external interrupt function is assigned to each pin. 4-bit I/O port (P2): each bit can be configured to be an input/output, pull-up/pull-down resistor input/high impedance input, or NMOS open drain output/CMOS output by port 2 control registers 0-3 (P20CON-P23CON). An external interrupt function is assigned to each pin. Output pin of buzzer driver Analog voltage input pins. Each of these pins can be switched to provide a constant current output by AD control register 0 (ADCON0).
Common connection pin for resistor for integration, capacitor 1 for offset compensation, and capacitor for integration. Pin for connecting capacitor 1 for offset compensation Pin for connecting capacitor for integration Pin for connecting capacitor 2 for offset compensation Reference voltage for A/D conversion (internally generated constant voltage) Pin for connecting resistor for voltage amplification circuit offset adjustment Analog micro-voltage input pin Pin for connecting resistor for voltage amplification factor adjustment
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Semiconductor Basic Functions (Continued)
Function Pin 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 LCD Drivers 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 Pad Symbol Type 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 L0/P3.0 L1/P3.1 L2/P3.2 L3/P3.3 L4/P4.0 L5/P4.1 L6/P4.2 L7/P4.3 L8 L9 L10 L11 L12 L13 L14 L15 L16 L17 L18 L19 L20 L21 L22 L23 L24 L25 L26 L27 L28 L29 L30 O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O LCD segment/common signal output pins Description
MSM64169
LCD segment/common signal output pins. These pins can also be mask-programmed to provide an output port.
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Semiconductor Basic Functions (Continued)
Function Pin 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 LCD Drivers 73 74 75 77 78 79 80 82 83 84 86 87 88 89 90 91 92 93 Pad Symbol Type 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 L31 L32 L33 L34 L35 L36 L37 L38 L39 L40 L41 L42 L43 L44 L45 L46 L47 L48 L49 L50 L51 L52 L53 L54 L55 L56 L57 L58 L59 L60 L61 L62 L63 O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O Description LCD segment/common signal output pins
MSM64169
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Semiconductor Secondary Functions
Function Pin 9 10 12 14 16 External Interrupts 17 19 21 22 24 25 26 Capture trigger 16 17 10 Serial Port 22 24 25 9 Timer 12 26 Pad Symbol Type 8 9 10 11 12 13 14 15 16 17 18 19 12 13 9 16 17 18 8 10 19 P0.0 P0.1 P0.2 P0.3 P1.0 P1.1 P1.2 P1.3 P2.0 P2.1 P2.2 P2.3 P1.0 P1.1 P0.1 P2.0 P2.1 P2.2 P0.0 P0.2 P2.3 I I I I/O I/O O I I O Receive data input pin (RXD) of serial port Transmit clock input/output pin (TXT) of serial port Receive clock output pin (RXC) of serial port Transmit data output pin (TXD) of serial port Capture trigger input pin of timer External clock input pin (TMC) of timer Timer overflow flag output pin (TMO) of timer Trigger input pin of the capture circuit I Description External level-sensitive interrupt input pins
MSM64169
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Semiconductor
MSM64169
MEMORY MAPS
Program Memory
Test program area 1FFFH 1FE0H 1FDFH
,,,,,,,,,,,,, ,,,,,,,,,,,,, ,,,,,,,,,,,,, ,,,,,,,,,,,,, ,,,,,,,,,,,,,
32 bytes
03BH 8160 bytes 038H 035H 032H 02FH 02CH 03EH Interrupt area 020H CZP area 010H 029H 026H 023H 020H
Watchdog interrupt External interrupt (0) Serial port receive interrupt Serial port transmit interrupt External interrupt (1) Timer interrupt ADC interrupt 32 Hz interrupt 16 Hz interrupt 1 Hz interrupt
000H
Start address 8 bits
Address 000H is the start address of the instruction execution at system reset. The "CZP" area from address 010H to 01FH is the start address for the CZP subroutine of onebyte call instruction. The interrupt area from address 020H to 3DH is assigned the start address of interrupt subroutines. 8160 bytes from address 000H to 1FDFH are available for users. The test program area cannot be used as a program memory area.
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Semiconductor Data Memory
MSM64169
The data memory area consists of eight banks and each bank has 256 nibbles (256 4 bits). The data RAM is assigned to BANK 4 through BANK 7 and Special Function Registers (SFRs) are assigned to BANK 0.
7FFH 700H 6FFH 600H 5FFH 500H 4FFH 400H
BANK 7 BANK 6 BANK 5 BANK 4
Stack area (256 nibbles)(also serves as data memory area)
Data RAM area
Contents of 000H to 0FFH 0FFH
Inaccessible area SFR area
100H 0FFH BANK 0 000H 4 bits 000H
Quarter the data RAM area (256 nibbles) also serves as the stack area. The stack is a memory starting from address 7FFH toward the lower-order addresses where 4 nibbles are used by subroutine call instruction and 8 nibbles are used by an interrupt. It has no access to the area from BANK 1 to BANK 3.
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Semiconductor
MSM64169
ABSOLUTE MAXIMUM RATINGS
Parameter Power Supply Voltage 1 Power Supply Voltage 2 Power Supply Voltage 3 Power Supply Voltage 4 Power Supply Voltage 5 Power Supply Voltage 6 Input Voltage 1 Input Voltage 2 Input Voltage 3 Input Voltage 4 Output Voltage 1 Output Voltage 2 Output Voltage 3 Output Voltage 4 Output Voltage 5 Storage Tempertaure Symbol VSS1 VSS2 VSS3 VSSL VSS VSSA VIN1 VIN2 VIN3 VIN4 VOUT1 VOUT2 VOUT3 VOUT4 VOUT5 TSTG Condition Ta=25C Ta=25C Ta=25C Ta=25C Ta=25C Ta=25C VSS2 input, Ta=25C VSS input, Ta=25C VSS1 input, Ta=25C VSSA input, Ta=25C VSS2 output, Ta=25C VSS3 output, Ta=25C VSS output, Ta=25C VSS1 output, Ta=25C VSSA output, Ta=25C -- Rating -2.0 to +0.3 -4.0 to +0.3 -5.5 to +0.3 -4.0 to +0.3 -5.5 to +0.3 -4.0 to +0.3 VSS2-0.3 to +0.3 VSS-0.3 to +0.3 VSS1-0.3 to +0.3 VSSA-0.3 to +0.3 VSS2-0.3 to +0.3 VSS3-0.3 to +0.3 VSS-0.3 to +0.3 VSS1-0.3 to +0.3 VSSA-0.3 to +0.3 -55 to +125 (VDD=VDDA=0 V) Unit V V V V V V V V V V V V V V V C
RECOMMENDED OPERATING CONDITIONS
(VDD=VDDA=0 V) Parameter Operating Temperature Operating Voltage Symbol Top VSS2 VSSA VSS 700 kHz OSC External Resistor Crystal Oscillator Frequency ROS fXT Condition -- VSS2=VSSA -- -- -- Range -40 to +85 -3.6 to -2.6 -5.25 to (0.8 * VSS2, -2.6 max) (*) 90 to 300 30 to 66 Unit C V V kW kHz
*
Indicates that the value of VSS is 80% of VSS2 and should not exceed -2.6 V.
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Semiconductor
MSM64169
ELECTRICAL CHARACTERISTICS
DC Characteristics
(VDD=VDDA=0 V, VSS2=VSS= -3.0 V, Ta= -40 to +85C unless otherwise specified) Parameter Symbol Condition +100% -50% +100% -50% Min. Typ. Max. Unit Measuring Circuit
VSS1 Voltage VSS3 Voltage VSSL Voltage XTOSC Oscillation Start Voltage XTOSC Oscillation Hold Voltage XTOSC Stop Detection Time XTOSC Internal Capacitance XTOSC External Capacitance XTOSC Internal Capacitance 700kOSC Internal Capacitance 700kOSC Oscillation Frequeney POR Generation Voltage POR Non-generation Voltage
VSS1 VSS3 VSSL VSTA VHOLD TSTOP CG CGEX CD COS fOSC VPOR1 VPOR2
Ca, Cb, C12=0.1 mF Ca, Cb, C12=0.1 mF --
-1.7 -1.5 -1.3 -4.7 -4.5 -4.3 -2.1 -1.5 -0.6 -- -- 0.1 10 10 10 8 -- -- 15 -- 15 12 -2.6 -2.6 20 30 20 16 910 0 -2
V V V V V pF pF pF pF kHz V V 1
Within 5 seconds after oscillation starts -- -- -- When CG external option is used -- -- External resistor ROS=100 kW, VSS2=-2.6 to -3.6 V POR generated when VSS2 is between VPOR1 and -3.0 V No POR generated when VSS2 is between VPOR2 and -3.0 V
-- 1000 ms
520 700 -0.7 -3 -- --
Notes: 1. 2. 3. 4.
"XTOSC" means a 32 kHz oscillation circuit. "700kOSC" means 700 kHz RC oscillation circuit. "POR" means Power-On Reset. "TSTOP" means that system reset will occur if XTOSC stops oscillation over this time.
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Semiconductor DC Characteristics (Continued)
MSM64169
(VDD=VDDA=0 V, VSS2=VSS= -3.0 V, Ta= -40 to +85C unless otherwise specified) Parameter Current Consumption 1 Current Consumption 2 Current Consumption 3 Current Consumption 4 Symbol IDD1 IDD2 IDD3 IDD4 Condition CPU in HALT state (700kOSC stop) CPU in operation (700kOSC stop) CPU in operation (700kOSC in operation) A/D converter in operation, CPU in HALT state Voltage amplification circuit stop Voltage circuit in operation -- 400 600 mA -- 200 300 mA -- 400 800 mA 1 -- 5 15 mA Min. -- Typ. Max. 1.2 4.5 Unit mA Measuring Circuit
(700kOSC stop) amplification
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Semiconductor DC Characteristics (Continued)
MSM64169
(VDD=VDDA=0 V, VSS1=VSSL= -1.5 V, VSS2=VSS=VSSA= -3.0 V, VSS3= -4.5 V, Ta= -40 to +85C unless otherwise specified) Parameter Output Current 1 (P0.0 to P0.3) (P1.0 to P1.3) (P2.0 to P2.3) Output Current 2 (BD) Output Current 3 (RI, CI, OPO0, OPO1) Output Current 4 (When L0 to L7 are output ports) Output Current 5 (OSC2) Output Current 6 (L0 to L30) Symbol IOH1 IOL1 IOH1S IOL1S IOH2 IOL2 IOH3 IOL3 IOH4 IOL4 IOH4S IOL4S IOH5 IOL5 IOH6 IOMH6 IOMH6S IOML6 IOML6S IOL6 Output Leakage (P0.0 to P0.3) (P1.0 to P1.3) (P1.0 to P1.3) IOOH IOOL Condition VOH1=-0.5 V VOL1=VSS+0.5 V VSS=-5 V, VOH1S=-0.5 V VSS=-5 V, VOL1S=VSS+0.5 V VOH2=-0.7 V VOL2=VSS2+0.7 V VOH3=-0.5 V VOL3=VSS+0.5 V VOH4=-0.5 V VOL4=VSS+0.5 V VSS=-5 V, VOH4=-0.5 V VSS=-5 V, VOL4S=VSS+0.5 V VOH5=-0.5 V VOL5=VSSL+0.5 V VOH6=-0.2 V (VDD level) VOMH6=VSS1+0.2 V (VSS1 level) VOMH6S=VSS1-0.2 V (VSS1 level) VOML6=VSS2+0.2 V (VSS2 level) VOML6S=VSS2-0.2 V (VSS2 level) VOL6=VSS3+0.2 V (VSS3 level) VOH=VDD VOL=VSS2 Min. -6 0.7 -9 1 -6 0.7 -3.0 15 -1.5 0.15 -2 0.2 -6 0.7 -- 4 -- 4 -- 4 -- -0.3 Typ. Max. -2 2 -3 3 -2 2 -1.2 30 -0.6 0.6 -0.7 0.7 -2 2 -- -- -- -- -- -- -- -- -0.7 6 -1 9 -0.7 6 -0.2 100 -0.15 1.5 -0.2 2.0 -0.7 6 -4 -- -4 -- -4 -- 0.3 -- Unit mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA 2 Measuring Circuit
15/25
Semiconductor DC Characteristics (Continued)
MSM64169
(VDD=VDDA=0 V, VSS1=VSSL= -1.5 V, VSS2=VSS=VSSA= -3.0 V, VSS3= -4.5 V, Ta= -40 to +85C unless otherwise specified) Parameter Symbol IIH1 Input Current 1 (P0.0 to P0.3) (P1.0 to P1.3) (P2.0 to P2.3) IIL1S IIH1Z IIL1Z Input Current 2 (OPP0, OPP1, OPN0, OPN1, VOF) Input Current 3 (VrA) Input Current 4 (OSC1) Input Current 5 (RESET, TST1, TST2) Input Current 6 (RCM, CZ1, CZ2 AIN0 to 3, RA) Input Voltage 1 (P0.0 to P0.3) (P1.0 to P1.3) (P2.0 to P2.3) Input Voltage 2 (OSC1, RESET, TST1, TST2) VIH1 VIL1 VIH1S VIL1S VIH2 VIL2 VSS=-5 V VSS=-5 V -0.6 -3.0 -1 -5 -0.6 -3.0 -- -- -- -- -- -- 0 -2.4 0 -4 0 -2.4 V V V V V V 4 IIL2 IIH2Z IIL2Z IIL3 IIH3 IIL4 IIH4Z IIL4Z IIH5 IIL5 IIH6Z IIL6Z IIL1 IIH1S Condition VIH1=VDD (When pulled down) VIL1=VSS VIH1=VDD, VSS=-5 V (When pulled down) VIL1=VSS=-5 V(When pulled up) -800 VIH1=VDD (At high impedance) VIL1=VSS VIL2=VSSA (At high impedance) 0 -1 0 -1 1 0 -1 0 -3 0 -1 (At high impedance) -250 -- -- -90 -- -- -250 8 -110 -- -- -- -1.5 -- -- -80 1 0 -30 1 0 -125 -- -10 1 0 1 -0.75 1 0 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA 3 Min. 30 80 Typ. Max. 90 -90 250 300 -30 800 Unit mA mA mA Measuring Circuit
(When pulled up) -300
(When pulled up) -300
VIH2=VDD (At high impedance) VIL2=VSSA (At high impedance) VIL3=VSSA VIH3=VrA+30 mV VIL4=VSS2 (ENADC=1)
(ENADC=0) -375 (When pulled up) -300
VIH4=VDD (At high impedance) VIL4=VSS2 (At high impedance) VIH5=VDD VIL5=VSS2 VIH6=VDD (At high impedance) VIL6=VSSA
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Semiconductor DC Characteristics (Continued)
MSM64169
(VDD=VDDA=0 V, VSS1=VSSL= -1.5 V, VSS2=VSS=VSSA= -3.0 V, VSS3= -4.5 V, Ta= -40 to +85C unless otherwise specified) Parameter Hysteresis Width (P0.0 to P0.3) (P1.0 to P1.3) (P2.0 to P2.3) Hysteresis Width (RESET, TST1, TST2) Input Capacitance (P0.0 to P0.3) (P1.0 to P1.3) (P2.0 to P2.3) CIN -- -- -- 5 pF 1 Symbol Condition Min. Typ. Max. Unit Measuring Circuit
DVT1 DVT1S DVT2 VSS=-5 V
--
0.2 0.25
0.5 1.0 0.5
1 1.5 1
V V V 4
--
0.2
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Semiconductor A/D Converter Characteristics
MSM64169
(VDD=VDDA=0 V, VSS2=VSS=VSSA= -3 V, Ta= -40 to +85C, VrA=-1.2 V, at execution of 12-bit A/D conversion, unless otherwise specified) Parameter (Pin Name) Analog Input Voltage Range (AIN0 to AIN3) Analog Input Voltage Range (OPP0, OPP1) (VOF) Resolution Linearity Error Zero Scale Error Full Scale Error VrA Voltage (VrA) VrA Temperature Coefficient VG Voltage (VG) RA Voltage (RA) Symbol Condition Min. Typ. Max. Unit Measuring Circuit
VAIN VOPP -- -- -- -- VrA -- VG VRA
-- -- -- -- -- -- Ta=25C -- Ta=25C Ta=25C
-1.2 -1.6 -- -1 -2 -16 -8 -867 -440
-- -- -- -- -- -- -- -800 -400
-0.4 -0.4 12+S* +1 +2 +16 2 -733 -360
V V bits LSB LSB LSB mV mV/C mV mV 5
-1300 -1200 -1100
*
"S" indicates a sign bit.
Voltage Amplification Circuit Characteristics
(VDD=VDDA=0 V, VSS2=VSS=VSSA= -3 V, Ta= -40 to +85C unless otherwise specified) Parameter (Pin Name) Symbol Condition (*1) VOPP1-VOPP0=10 mA, Gain=40 Amplifier Gain Error *1 Eg (*2) (VOPO1-VOPO0)/(VOPP1-VOPP0) -1 Eg= Gain (VAIN3-VVOF) -1 EI= (VOPO1-VOPO0) -3.0 -1.5 0 % 5 -4 -- +4 % Min. Typ. Max. Unit Measuring Circuit
Level Shift Error *1
EI
*1 Errors caused by offset voltage are excluded. *2 Errors decrease in proportion to gain.
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Semiconductor Measuring Circuit 1
MSM64169
Rs1 VDD AIN0 OSC1 ROS OSC2 VSSL VDDA
Rs0 RI CZ1 CI CN VrA RCM RI CZ1 CI CZ2 VG XT XTAL MSM64169 XT C1 C2 VDD VSSA VSS2 A VSS1 VSS3 VSS Ca, Cb, C12, CL ROS XTAL RI CI, CZ1, CZ2 CN Rs1 Rs0 : 0.1 mF : 100 kW : 32.768 kHz : 750 kW : 0.1 mF : 1000 pF : 100 kW : 10 kW C12 CZ2
CL
Ca V
Cb V
V
Measuring Circuit 2
(*2) Output VIH (*1) VIL VDDA VDD VSS1 VSS2 VSS3 VSSL VSS VSSA A
Input
MSM64169
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Semiconductor Measuring Circuit 3
MSM64169
(*3) A
Input
MSM64169
VDD
VDDA VSS1
VSS2
VSS3
VSSL
VSS VSSA
Measuring Circuit 4
Output
(*3) VIL
MSM64169
VDDA
VDD
VSS1
VSS2
VSS3
VSSL
VSS VSSA
*1 Input logic selects specified state. *2 Repeated for each specified output pin. *3 Repeated for each specified input pin.
Output
VIH
Input
Waveform Check
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Semiconductor Measuring Circuit 5
MSM64169
RA RV0F RS RI VDD AIN0 VOF VrA RA RCM OPO0 R0 Rg R1 OPN0 OPN1 OPO1 VSSL VDDA VDD VSSA VSS2 VSS1 VSS3 RI CZ1 CI CZ1 CI CN CZ2 VG XT XTAL XT C1 C2 VSS Ca, Cb, C12, CL XTAL RI CI, CZ1, CZ2 CN RA RVOF RS R0, R1 Rg : 0.1 mF : 32.768 kHz : 750 kW : 0.1 mF : 1000 pF : 10 kW : 10 kW max : 10 kW max : 270 kW : 100 kW max C12 CZ2
CL
Ca
Cb
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Semiconductor
MSM64169
FUNCTIONAL DESCRIPTION
CPU Peripheral Function * A/D converter (ADC) The MSM64169 has a 4-channel input dual slope A/D converter. In dual slope A/D conversion, the relationship between integral voltage and time is given by: Vin/Vr = t1/t2 where, t1 = given time for which an analog input voltage is integrated Vr = reference voltage Vin = voltage resulted from charging for t1 t2 = time required to discharge the voltage, from Vr to Vin From the above equation, Vin is found. The range of Vin is -0.8 0.4 V. The A/D converter resolution time is programmable. The A/ D converter has a preamplifier for amplifying a microvoltage. It is suited to applications such as thermometer, pressure gauge, and hygrometer. * LCD driver (LCD) The MSM64169 has a built-in LCD driver for 64 outputs. The LCD driver consists of 64 4-bit display registers (64 nibbles out of DSPR0 to 127), a display control register (DSPCON), a 63-output LCD driver circuit, and a bias generation circuit (BIAS). There are three types of driving methods: 1/4 duty, 1/3 duty and 1/2 duty. A mask option can select either a common driver or a segment driver for each LCD driver pin. A mask option can also specify the assignment of each bit of the display register to each segment. L0 to L7 of the LCD driver can become output ports via a mask option. The relationship between the duty, the bias method and the maximum segment number follows: 1/4 duty 1/3 bias method ......... 240 segments 1/3 duty 1/3 bias method ......... 184 segments 1/2 duty 1/2 bias method ......... 124 segments * Port (P0, P1, P2) The MSM64169 has three input-output ports (P0, P1, P2) with 4 bits each. Each bit of the ports can be configured to be an input or output, pull-up/pull-down resistor input or high impedance input, or NMOS open drain output or CMOS output. A change in the input level of each pin of P0 and P1 generates an external interrupt 0 request, and a change in the input level of each pin of P2 generates an external interrupt 1 request. The serial port function and the timer function area assigned as the secondary funciton. * Buzzer driver (BD) The MSM64169 has a built-in buzzer driver with two buzzer output frequencies and four buzzer output modes. Each buzzer output is selected by the Buzzer Control Register (BDCON) and the Buzzer Frequency Control Register (BFCON). * Serial port (SIOP) The MSM64169 has a serial port (SIOP). The serial port is a synchronous/asynchronous selectable serial communication port. The transmit section and the receive section are independent of each other, which allows simultaneous operation of transmission and receiving.
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MSM64169
* Watchdog timer (WDT) The MSM64169 has a built-in watchdog timer to detect CPU run-away. The watchdog timer consists of a 6-bit watchdog timer counter (WDTC), which counts the 16 Hz output of the time base counter, and a watchdog timer control register (WDTCON) to reset WDTC. * Capture circuit (CAP) The MSM64169 captures a 32 Hz to 256 Hz output of the time base counter at the falling edge of Port 1.0 or 1.1 (P1.0 or P1.1) when the pull-up resistor input is chosen, or at the rising edge when the pull-down resistor input is chosen. The capture circuit is composed of the Capture Control Register (CAPCON) and the Capture Registers (CAPR0, CAPR1) that fetch output from the time base counter. *Timer (TM) The MSM64169 has a 16-bit timer (TM). The timer has three operation modes: auto-reload mode, capture mode, and clock frequency measuring mode. It counts at 32.768 kHz or 700 kHz or by an external clock. The timer is used for pulse generation, time measurement, etc., and is also used as an A/D conversion counter at A/D conversion and as a baud rate generator at serial communication. * Clock generation circuit (2CLK) The MSM64169 has a clock generation circuit (2CLK) that generates clocks of two types: lowspeed and high-speed. The circuit consists of a 32.768 kHz crystal oscillation circuit, a 700 kHz RC oscillation cricuit, and a clock control section. This circuit generates the system clock (CLK), crystal oscillation clock (32.768 kHz), and RC oscillation clock (700 kHz). The system clock is the basic operation clock of the CPU, and the crystal oscillation clock is the basic operation clock of the time-base counter and the buzzer driver. The crystal oscillation clock and RC oscillation clock are supplied to the timer to become a timer clock. The system clock frequency is switched between 32.768 kHz (output of the crystal oscillation circuit) and 700 kHz (output of the RC oscillation circuit) based on the contents of the frequency control register (FCON). Note: The oscillation frequency of the RC oscillation circuit varies depending on the value of external resistor (ROS), operating voltage (VSS2), and ambient temperature (Ta). * Time base counter (TBC) The MSM64169 has a built-in time base counter (TBC) that generates clocks to be supplied to internal peripheral circuits. The time base counter is composed of 15 binary counters. The count clock of the time base is supplied by the oscillation clock (32.768 kHz) of the crystal oscillation circuit. Output of the time base counter is used for buzzer driver, system reset circuit, watchdog timer, time base interrupt, sampling clocks for each port, and LCD driver. * Interrupt (INTC) The MSM64169 has ten interrupt sources (ten vector addresses) of which two are external interrupts from ports and eight are internal interrupts. Of the ten interrupt sources, only the watchdog interrupt cannot be disabled (non-maskable interrupt). The other nine interrupts are controlled by the master interrupt enable flag (MI) and the interrupt enable registers (IE0, IE1 and IE2). When an interrupt condition is met, the program branches to a vector address corresponding to the interrupt source, and then control is passed to the interrupt routine.
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APPLICATION CIRCUIT
LCD
ROS OSC2 OSC1 RESET VDD XT XT P1.0 P1.1 P1.2 P1.3 P0.0 P0.2 P0.3 P2.1 TxD RxD Asynchronous serial communication P2.0 P0.1 AIN3 OPP0 OPP1 AIN0 RA VDDA OPO0 OPN0 OPN1 OPO1 AIN1 VrA VG CZ2 RI RCM CZI CI VSSA AIN2 VOF L63 L0
32.768 kHz
CGEX Switch Matrix (4 4)
MSM64169-XXX
VDD C2 C1 C12 VSS3 C3 VSS2 VSS VSS1 VSSL TST2 TST1 BD
C2 3V 5V
CS
C1 CL * 5 V interface * Pressure measurement by pressure sensor (AIN0, 3) * Temperature measurement by thermistor (AIN1) * Detection of low voltage (AIN2) * CGEX for crystal oscillation circuit : external fixing
RI CI CZ CZ2 CN
Pressure sensor
MSM64169
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MSM64169
PACKAGE DIMENSIONS
(Unit : mm) QFP128-P-1420-0.50-K
Mirror finish
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 1.19 TYP.
Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 25/25

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